WiWing, a major server manufacturer, has been developing cloud data center IT infrastructure equipment for a long time and is committed to the vision of "releasing digital energy and igniting sustainable innovation." At the 2025 OCP Global Summit held in San Jose, California, USA, Wiwynn and Wistron jointly demonstrated a new generation of AI servers and simultaneously demonstrated advanced direct liquid cooling (Direct Liquid Cooling, DLC) solutions.
Wiwynn General Manager and CEO Lin Weiyuan said that we are honored to showcase the latest accelerated computing solutions and cooling technology innovations at the OCP Global Summit. Through close cooperation with industry leaders, we continue to push the limits of AI computing performance and cooling performance. These collaborations will result in a range of state-of-the-art products and solutions to meet the huge needs of modern and traditional data centers in the AI era.
⚫ NVIDIA GB300 NVL72: Wiwynn and Wistron are among the first partners to offer NVIDIA GB300 NVL72 systems. This liquid-cooled, rack-level AI system is equipped with 72 NVIDIA Blackwell UltraGPUs and equipped with NVIDIA ConnectX-8 800Gb/s SuperNICs to provide unprecedented computing performance for the inference of inference models, leading a new wave of accelerated computing.
⚫ NVIDIA HGX B300: NVIDIA HGX B300 is a new 10U server powered by eight NVIDIA Blackwell UltraGPUs, with up to 2.1TB of HBM3e memory and NVIDIA ConnectX-8 800Gb/s SuperNICs, delivering breakthrough performance for complex AI workloads.
⚫ AMD InstinctTM MI350 series GPU system: equipped with AMD InstinctTM MI350 series (AMDCDNATM 4) GPU, EPYCTM CPU and AMD Pollara 400 AI Network Interface Card, the system inference performance is improved by up to 35 times compared to the previous generation.
⚫ Double-Wide Rack Architecture: By doubling the width of traditional racks, it supports AI chips with larger area and higher power consumption. The architecture also integrates high-voltage direct current (HVDC) power supply, advanced liquid cooling technology, and system design optimized for signal integrity to meet the data, power, and heat dissipation challenges faced in high-density computing. This new architecture is built to support next-generation accelerators, such as AMD InstinctTM MI400 series GPUs. Designed to provide powerful rack-level performance for the most advanced AI training and inference.
⚫ Double-sided Cold Plate: On display is a double-sided liquid cold plate specially designed for future high-power ICs, which can simultaneously provide up to 4 kW of heat dissipation capacity for the AI accelerator and its matching vertical power supply IC. Combining Wiwynn's own micro-channel design and advanced electrochemical 3D printing technology, it is expected to increase heat dissipation efficiency by up to 40%.
⚫ Two-phase Cold Plate: For two-phase direct liquid cooling systems using non-conductive environmentally friendly refrigerant, Wiwynn has launched a patented 3D printing wicking-fin liquid cooling plate design. The system can use the phase change mechanism to enhance heat dissipation efficiency and reduce downtime caused by liquid leakage, providing a high-efficiency and high-reliability solution for large-scale liquid-cooled AI and high-performance computing (HPC).
⚫ 300kW AALC Sidecar: The double-cabinet-width AALC (Air-Assisted Liquid Cooling) system developed in cooperation with Shinwa Controls Co., Ltd. further improves the AALC cooling capacity while providing high reliability and easy maintenance, allowing the data center to deploy liquid-cooled AI cabinets without changing the existing infrastructure.
⚫ OCP Future Technologies Symposium: Wiwynn and Fabric8Labs will release "Next-generation cold plate with electrochemical 3D-printed microchannels for Ultra-high heat fluxes beyond 350W/cm2 (Next-generation cold plate with electrochemical 3D-printed microchannels for Ultra-high heat fluxes beyond 350W/cm2)". The content will provide an in-depth explanation of how advanced heat dissipation technology and IC packaging co-design can improve the heat dissipation performance of liquid cooling plates in liquid cooling systems.
Cutting-edge Network Solutions Section:⚫ NVIDIA Spectrum-X: Exhibiting the NVIDIA Spectrum-X Ethernet platform based on NVIDIA Spectrum-4 MAC technology. The platform integrates SONiC and NVIDIA Cumulus to provide advanced Ethernet connectivity for multi-tenant, ultra-large-scale artificial intelligence cloud services, enabling flexible data center deployment.
⚫ Broadcom Tomahawk 6: A 102T data center switch designed specifically for modern data centers. It uses the latest Broadcom Ethernet Switch and can support 64 ports in a 4RU air-cooled system with a transmission speed of 1.6Tbps per port, demonstrating powerful performance and high-density connection capabilities.