Infinitesima, an advanced semiconductor measurement technology company in the UK, announced a three-year cooperation project with Belgium imec to enhance its Metron3D online 3D round measurement system, focusing on advanced process applications such as High-NA EUV, Hybrid Bonding, CFET, etc., and participated by industry leaders such as ASML to solve the urgent need for high-analytic 3D measurement in future semiconductor manufacturing.
Research and development agency TechInsights predicts that the global 3D semiconductor structure and advanced packaging processes will push the wafer volume measurement market to US$7.6 billion in 2025, of which online, high-resolution 3D quantity measurement technology is regarded as the most powerful application field.
Infinitesima pointed out that this project will use Metron3D 300mm in-line (in-line) round measurement system to optimize and explore cutting-edge applications, including Hybrid Bonding, High-NA EUV microfilm, and 3D logical device structures such as intercomplementary field effect transistors (CFETs).
Infinitesima said that the project will combine partners' deep professional knowledge and company's Rapid Probe Microscope (RPM™) technology to achieve in-depth three-dimensional surface detection, high-speed image extraction and interference levels. This will help provide high throughput, detailed 3D quantity testing information on the overall morphology of the key structure in response to the urgent needs of the industry in a high-capacity manufacturing environment.
As part of the project, Infinitesima will be installed in the imec system equipment, which will be used by partners including ASML to continuously advance the characteristics and process development of High-NA EUV photoresist imaging.
Infinitesima emphasizes that this close collaboration with imec aims to achieve true three-dimensional process control and develop new generation quantitative testing system functions and enhanced technologies, which are key to the production of future semiconductor devices. Executive Peter Jenkins pointed out that it is fortunate to further expand the cooperation with Imec to solve the advanced volume test challenges faced by the most critical process steps in the next generation of semiconductor processes.
Infinitesima's collaboration with imec began in 2021, initially focusing on the use of patented technology RPM™ to implement tip-induced nanoscale tomographic sensing, which is used in the fields of research and failure analysis. This new collaboration plan is expanded to the high-speed online production volume measurement field to support the advanced testing and measurement needs of semiconductors for Asian nano-level characteristics and increasingly complex 3D structures.
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