Fanout panel packaging (FOPLP) is recognized as the next generation of advanced packaging and display. The three strong semiconductors such as crystal foundry, Longtou Tel, semiconductor packaging, Sun and Moonlight, and memory packaging, Longtou Licheng, are all extremely fast and high-speed computing chip high-integration advanced packaging manufacturers such as NVIDIA and Ultramicro.
The three-strong fan-out panel-level packaging area of the semiconductor body has made great progress, each with its own calculations, triggering a new wave of single-stop wars.
Taiwan electric power technology is named CoPoS (Chip-on-Panel-on-Substrate), and its production capacity is a practical test line in 2026. Sun and Moonlight Kaohsiung has a 300×300mm panel-level packaging line; the longest effort was achieved, and it was named PiFO (Pillar integration FO).
Industry analysis, high-speed computing chips have their own advantages in high integration, panel-level fan-out packaging is relatively circular, substrate surface is larger and can be integrated in a different manner, and circuit design with 5G communication filter function is integrated. After packaging, the chip performance and functions are greatly improved, which is more suitable for various products such as 5G communication and Internet equipment, which helps the volume of various consumer electronic products be reduced.
Taiwan Electric CoPoS focuses on AI and high-speed computing (HPC) applications, and exports mass production in 2028. It is CoWoS "panelized" to convert it into a square design, which is conducive to the expansion of chip production capacity. Taiwan Electric North American Technology Forum has launched the latest A14 process, and also predicts that the 2027 volume production of CoWoS can be 9.5 times the mask size, which can integrate more logic and memory chips into one packaging, and the industry's forecast trend is consistent with the development of CoPoS.
Sun and Moonlight already has a 300×300mm panel-level packaging line, adopting FanOut process.
Licheng named its fan-out panel-level packaging technology PiFO, which is similar to NTD CoPoS.